The sales volume of China's IC packaging and testing industry set a new record in the first half of the year

As an indispensable link in the integrated circuit industry chain, the integrated circuit packaging and testing industry is accompanied by the continuous development and change of integrated circuit chips. In recent years, its position in the whole integrated circuit industry chain has become increasingly prominent. Driven by the outline for promoting the development of the national integrated circuit industry and the national integrated circuit industry investment fund, the integrated circuit packaging and testing industry has shown unprecedented vitality at the level of capital M & A, and the growth rate is much higher than the global average. In particular, with the rapid launch of the national major science and technology project "very large scale integrated circuit manufacturing equipment and complete set of technology", the technical capacity and process level of the packaging and testing industry have been continuously improved, the advanced packaging technology and process of medium and high-end products have been continuously in line with the international level, and the product structure has been continuously optimized.
In the past five years, the strength of domestic enterprises in the domestic sealing and testing industry has been continuously enhanced
By the end of 2016, there were 89 domestic IC packaging and testing enterprises above Designated Size, of which local enterprises or domestic holding enterprises accounted for 35%. Domestic enterprises mainly seal and test on behalf of industry, and foreign-funded enterprises mainly seal and test their own products with IDM as their parent company. Among the top ten enterprises in the world's integrated circuit packaging and testing industry, Changdian technology entered in 2012 and ranked sixth. In 2016, Changdian technology ranked third with sales of US $2.899 billion, a year-on-year increase of 12.6%, accounting for 14.90% of the total revenue of the world's top ten integrated circuit packaging and testing enterprises; Huatian technology and Tongfu micro power also entered the top ten enterprises in the world, ranking seventh and eighth.
The scale of IC packaging and testing industry is expanding. From January to June 2017, the sales of domestic IC packaging and testing industry reached 80.01 billion yuan, a year-on-year increase of 13.2%, reaching the sales of the whole year of 2012. In 2016, the sales revenue of domestic IC packaging and testing industry was 152.32 billion yuan, 189.2% of 80.568 billion yuan in 2012. It is estimated that by 2017, the sales revenue of domestic IC packaging and testing industry will be twice that of 2012.
In recent years, the distribution of IC packaging and testing industry has become more reasonable. Domestic packaging and testing enterprises are mainly concentrated in the Yangtze River Delta, Beijing Tianjin Bohai Bay, central and Western China and the Pearl River Delta, accounting for 56.2%, 14.6%, 12.4% and 12.4% respectively; Other regions accounted for 4.4%.
The technological innovation ability of domestic sealing and testing industry has been continuously improved
The four leading domestic IC packaging enterprises, Changdian technology, Tongfu micro power, Huatian technology and Jingfang technology, have continuously deepened the layout, strengthened R & D and made some progress in advanced packaging technology, representing the advanced process and technology level of domestic IC packaging and testing. According to the incomplete statistics of the packaging and testing industry, by 2016, the proportion of medium and high-end advanced packaging in domestic integrated circuit products was about 32%, and the proportion of advanced packaging in the integrated circuit products of some major packaging and testing enterprises in China had reached the level of 40% ~ 60%.
Changdian technology has the global patented substrate technology of micro integrated system, which is widely used in QFN, LGA and BGA packaging of multi chip and sip integration. The key technology is to realize the fan in and fan out design capability on the panel packaging, and the fine size brings ultra-small and ultra-thin packaging. In micro integrated system substrate technology (MIS), 25 μ M ultra thin chip stacking technology has reached the international advanced level and has a number of independent intellectual property rights. At the same time, the low-cost and high-density advanced flip chip packaging technology fccube based on Cu pillar significantly reduces the high cost caused by dense spacing and high I / O in flip chip packaging.
Huatian technology has made great progress in the research and development of multi turn V / uqfn, fcqfn and aaqfn packaging technology. In terms of TSV (SIP) packaging technology, 12 inch image sensor wafer level packaging and silicon-based microphone substrate packaging have realized large-scale mass production; In fingerprint identification, TSV silicon through-hole wafer level packaging scheme and ultra-thin lead plastic packaging technology are developed; FCBGA packaging technology of domestic CPU has been successfully mass produced; FC + WB technology and PA packaging technology have entered the stage of mass production.
Tongfu microelectronics has made good progress in advanced packaging fields, such as BGA, fc-csp (copper pillar), WLP, sip, etc. Successful mass production in the whole process of 12 inch 28nm advanced packaging test. On copper clip products, multi chip packaging is realized. A single product contains up to 4 clips without bonding, and mass production is realized through customer reliability verification.
Suzhou Jingfang focuses on the field of advanced packaging and adheres to independent research and development. Its cis wafer level advanced packaging, fingerprint identification chip wafer level advanced packaging and MEMS wafer level advanced packaging have reached the international advanced level. Further invest in the development of the next generation of advanced packaging technology for new fields such as virtual reality, intelligent manufacturing and automotive electronics.
Significant achievements have been made in major science and technology projects in the sealing and testing sector
According to preliminary statistics, under the active promotion of the strategic alliance for technological innovation of the IC packaging and testing industry chain, the national major science and technology special project "very large scale integrated circuit manufacturing equipment and complete set of technology" gave full play to the advantages of "big Corps operation", and by the end of 2016, the sales of major special projects reached 10.447 billion yuan, 2622 patents were applied for and 1240 authorized.
Under the promotion of major national science and technology projects, advanced integrated circuit packaging technology has made great progress. Internationally leading advanced packaging technologies such as tsv-cis, wafer bumping, FBGA, fc-bga, WLCSP, FBGA, MEMS and RF SIP have been successfully developed or introduced into mass production on a large scale. Changdian technology, Huatian technology, Tongfu micro electronics and other enterprises have made new breakthroughs in the fields of "3d-mis packaging technology", "multi circle fcqfn packaging technology" and "fccsp packaging technology products". Suzhou Jingfang took the lead in building the world's first 12 inch CIS TSV wafer level packaging mass production line. The development and industrialization of high-density packaging technology, high-power device packaging technology and packaging system integration technology corresponding to high-end 40nm / 28nm technology nodes have begun to show results; Further increase the scale and proportion of high-end packaging, and have the comprehensive supporting capacity (design, development, packaging, testing, etc.) with domestic and some foreign IC design enterprises; The new independent intellectual property packaging technology has been recognized by the international mainstream and began to enter mass production.
With the support of major national science and technology projects, the R & D level of domestic enterprises has been continuously improved. The projects such as "development and industrialization of high-end packaging process and high-capacity flash integrated packaging technology" have successfully passed the acceptance of the special organization, and have successfully won the continuous growth of orders from high-end customers at home and abroad. The packaging test equipment and material application engineering project and the packaging test process, equipment and material development and industrialization project have been carried out smoothly, such as the R & D of a series of advanced packaging technologies such as no pin, detail distance, multi chip, lamination, chip level, system level, wafer level and silicon perforation, the cooperation between industry chain, industry, University, research and application has been further strengthened, and the innovation system, innovation strength The innovation effect has been greatly improved, which has promoted the healthy development of China's IC packaging and testing industry chain.
What's more gratifying is that Huajin semiconductor packaging leading technology R & D center, jointly invested and established by the Institute of microelectronics of the Chinese Academy of Sciences and nine leading enterprises in the packaging and testing industry, including Changdian technology, Tongfu microelectronics, Huatian technology, Shennan circuit and Suzhou Jingfang, has carried out research on system level packaging / integration leading technology through a new mode of combination of industry, University, research and application with enterprises as the main body, Research fields include key technologies of 2.5d/3d silicon via (TSV) interconnection and integration, wafer level high-density packaging technology, SIP product application, and verification, improvement and R & D of materials and equipment related to packaging technology. At present, it has built a complete 12 inch (compatible with 8 inches) medium process production and processing platform and micro assembly platform, two engineering R & D centers and three public technical service platforms, with 12 inch wafer TSV manufacturing technology capability, detail distance micro bump manufacturing capability and advanced packaging micro assembly capability, as well as chip front-end testing and reliability analysis capability, And advanced packaging design simulation capability. It can not only provide enterprises with services such as package technology development, technology transfer and process processing, but also provide the industry with a public service R & D platform to tackle common technologies. Chinese enterprises have 585 domestic (International) patents, provided hundreds of technical services for more than 100 enterprises, developed a variety of products with industrialization prospects, derived and incubated a number of enterprises.
The participation of industrial funds will further expand and strengthen the sealing and testing industry
With the gradual implementation of the outline for the promotion of the development of the national integrated circuit industry and the launch of the national integrated circuit industry investment fund project, domestic leading enterprises have successively started production expansion, acquisition and reorganization, driving the great integration of the whole integrated circuit industry, and domestic sealing and testing enterprises have also accelerated the internationalization process. Such as Changdian technology's acquisition of Xingke Jinpeng, Tongfu micro electricity's acquisition of AMD sealing and testing plant, Huatian technology's acquisition of American FCI, which has greatly strengthened the technical strength of domestic enterprises.
SMIC has become the largest single legal shareholder of Changdian technology, making every effort to move towards the virtual IDM plant and attracting the high attention of IC designers. In particular, Qualcomm has invested in SMIC Changdian, and MediaTek has also actively cooperated with Changdian technology and Tongfu micro power, highlighting the new strategy of alliance between wafer foundry and packaging and testing plant, which has been gradually integrated into new forces. SMIC Changdian, built by Changdian technology in cooperation with SMIC international, has the ability of 12 inch bump processing and supporting wafer chip testing. It has successfully implemented 12 inch bump packaging, which is better close to China, the world's largest mobile terminal market, so as to help chip design companies significantly shorten the market response time and better serve the rapidly updated mobile terminal market. Tongfu microelectronics has carried out strategic cooperation with Huahong Hongli and Shanghai Huali in chip design, 8 / 12 inch chip manufacturing, bump manufacturing, micro bump testing and other middle process technologies, FC / TSV / SIP and other advanced packaging and testing technologies, cooperated in the development of relevant technologies, realized the connection of the whole industrial chain, complementary advantages and resource sharing, and formed a strategic alliance of win-win cooperation.
In addition, Changdian technology has also invested and expanded production in Suqian in Northern Jiangsu and Chuzhou in Anhui. Huatian technology has implemented industrial expansion in Xi'an, Kunshan and other places respectively, and Tongfu micro power has implemented investment expansion in Hefei and Xiamen.
Collaborative innovation is the key to promote the next development of sealing and testing industry
From the development direction of the post Moore era, the development of packaging and testing technology will bring unprecedented opportunities for industrial development. All-round collaborative innovation of the industrial chain will be one of the important ways to promote the further development of China's IC packaging and testing industry.
Huajin semiconductor, a common technology R & D platform, is a beneficial exploration of enterprise innovation and cooperation mode in the post Moore era. Huajin model has solved the contradiction between competition and cooperation among enterprises, made full use of the advantageous resources among enterprises, and also solved the ownership of intellectual property rights in the R & D process. The R & D platform has played a good role in promoting the overall technical level of the industry.
Synergy between wafer and packaging - SMIC Changdian. With the birth of "middle way", the cooperation between packaging and testing enterprises and wafer manufacturing enterprises has become a new collaborative model. Changdian technology and SMIC have established an industrial chain with 12 inch bump processing and supporting testing capabilities, adopted the pure OEM mode, and focused on the development and manufacturing of advanced processes in the middle of semiconductors; Huatian technology and Wuhan Xinxin, Tongfu micro power and Huali electronics have launched in-depth cooperation one after another.
Collaborative design is an innovative model of design and packaging based on product R & D. Nowadays, the chip function and power management are becoming more and more complex, and the packaging structure is becoming more and more complex. The traditional IC package PCB sequential design sequence is no longer suitable for today's products. Integrated collaborative design between IC package PCB has become inevitable.
Consortium collaboration, which is based on the collaborative innovation model of sealing and testing industrial chain. It is mainly composed of end users, design enterprises, chip enterprises, sealing and testing enterprises, and material and equipment suppliers to cooperate with the advantageous technologies, talents and resources of the industrial chain to solve the dilemma of lack of funds, talents, technology and equipment for key technologies, large-scale equipment and core materials in the early stage of R & D, and finally meet the industrial needs of end users.

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Keyword：Record sales of integrated circuit packaging and testing industry   national outline for promoting the development of integrated circuit industry   national integrated circuit industry investment fund   Yangtze River Delta   Beijing Tianjin Bohai Bay   central and Western China   Pearl River Delta   Changdian technology   Tongfu micro electricity   Huatian technology   Jingfang Technology   Commax-Tech Electronic